Products

Metal Target

Copper (Cu) target

Purity: 99.97%~99.9999%
Manufacturing method: dissolution method

LCD displays
Touch panels
Semiconductor electrodes

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Chromium (Cr) target

Purity: 99.5%~99.98%
Manufacturing method: HIP method, density ≧99%

Automotive mirrors, semiconductor wiring, displays, hard disks, electronic components, decorative coatings, sensitive materials

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Niobium (Nb) target

Purity: 99.9%~99.999%
Manufacturing method: Vacuum smelting method

Thin film formation
Superconducting materials
Heat- and corrosion-resistant applications

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Zirconium (Zr) target

Purity: 99.5%~99.99%

Semiconductors: High-K insulating films, ferroelectric memory
Optical lenses, mirror coatings
Surface coatings, corrosion resistance, heat resistance, nuclear

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Titanium (Ti) target

Purity: 99.5%~99.999%
Manufacturing method: dissolution method

Semiconductor electrodes
Integrated circuits
Liquid crystal displays

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Tantalum (Ta) target

Purity: 99.9%~99.999%
Manufacturing method: Vacuum smelting method

Capacitor manufacturing
Thin film formation (optics, aerospace)
High-temperature technology

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Iron (Fe) target

Purity: 99.9%~99.999%
Manufacturing method: Vacuum smelting method

Thin film formation
Superconducting materials
Heat- and corrosion-resistant applications

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Hafnium (Hf) target

Purity: 99.5%~99.9%

Semiconductors: High-K gate dielectrics for reduced leakage current
High-bandwidth memory, aerospace (supersonic aircraft)
Optical coatings, sensitive materials

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Nickel (Ni) target

Purity: 99.9%~99.99%
Manufacturing method: dissolution method

Semiconductor electrodes, integrated circuits, liquid crystal displays, touch panels

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Tin (Sn) target

Purity: 99.9%~99.995%
Manufacturing method: Vacuum smelting method

Semiconductors, displays, solar panels, thin film formation for electronic devices and architectural glass

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Tungsten (W) target

Purity: 99.9% - 99.999%
Manufacturing Method: Sintering + Rolling

Semiconductor electrodes
Integrated circuits
Heat dissipation layers in high-power electronic devices

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Alloy Target

Nickel chromium (NiCr)
target

Purity>99.5%~99.9%
Manufacturing method: Vacuum smelting method

Thin film formation, microelectronics manufacturing
Low-E coating for architectural glass
LCD panels, recording media, semiconductors, and solar cells

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Aluminum neodymium (Al-Nd)
Target

Purity > 99.95%
Manufacturing Method: Vacuum Melting
Size: 809.5 x 879.5 x 16mm (single piece available)

Flat panel displays (FPDs)
Magnetic recording media, magnetic sensors

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Tungsten Titanium (W-Ti)
Target

Purity>99.95%
Manufacturing method: powder metallurgy method

Microchips, thin film formation, solar cells
Diffusion inhibitors and adhesives for metal wiring

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Nickel vanadium (NiV)
target

Purity>99.5%~99.9%
Manufacturing method: Vacuum smelting method

Integrated circuit (IC) manufacturing
Semiconductor and microelectronics industry
High-quality thin film deposition

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Aluminum silicon (Al-Si) target

Purity >99.999%
Manufacturing method: Sintering

Flat Panel Displays (FPDs)
Magnetic Recording Media
Magnetic Sensors

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C18200 (CuCr) Backing plate

Purity>99.97%
Manufacturing method: Vacuum smelting method

Used as a backing plate
Hardness ≥ 1/2H

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Nickel Copper (NiCu)
Target

Purity>99.9%
Manufacturing method: Vacuum smelting method

Semiconductor integrated circuits (VLSI)
Flat panel displays
Optical discs, surface coatings

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Aluminum titanium (Al-Ti) target

Purity>99.999%
Manufacturing method: smelting method

Cutting tool coatings, barrier film formation
Semiconductor device transistors and integrated circuits
Display and decorative coatings

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C18150 (CuCr1Zr) Backing plate

Purity>98%
Manufacturing method: Vacuum smelting method

Used as a backing plate
Hardness ≥ 1/2H

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Oxide Target

Titanium dioxide (TiO₂) target

Purity >99.9% Conductivity
Density ≥90%
Vacuum sintering, HP method

High-refractive-index lenses, optical filters, semiconductors
Recording media such as hard disk drives
Thin-film formation for flat panel displays
Photocatalysts (decomposition of atmospheric nitrogen oxides, antibacterial properties)

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Nickel oxide (NiO) target

Purity > 99.99%
Density ≥ 85%
Sintering method, HP method

Resistive Random Access Memory (RRAM)
Transparent Conductive Oxide (TCO)
Gas Sensors
Spintronics

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Tin oxide (SnO) target

Purity > 99.99%
Density ≥ 85%
Sintering method, HP method

Important materials for screen construction
Transparent electrodes enabling touchscreen operation
Anti-static film, electromagnetic wave shielding film
Transparent heater, gas sensor

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Indium antimonide (IAO) target

Purity > 99.99%
Density ≥ 85%
Sintering method
HP method

Anti-static coatings, widely used in paints, significantly reduce static buildup, and protect the safety of equipment and personnel.

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Vanadium oxide (V₂O₅) target

Purity > 99.9% *Toxic
Density ≥ 85%
Vacuum sintering, HP method

Thin film deposition for high-definition displays and optical devices
Optical coatings and sensor technology
Catalysts for organic acid production
Improved solar cell performance and efficiency

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Quartz (SiO₂) ring

Purity>99.995%
Density (2.6g/cm³)
Sintering method

Semiconductor manufacturing process
Optical equipment
Chemical laboratory equipment
Medical equipment

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niobium-oxide-target-electrically-conductive

Niobium oxide (Nb₂O₅) target

Purity>99.9% *Electrically conductive
Density≧99%
HIP method

Miniaturization and high performance of optical products
Multilayer ceramic capacitors (MLCC)
LCD panels, hard disks
Thin-film formation in semiconductors, solar cells

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ITO (90% In₂O₃ 10% SnO₂) Target

Purity>99.99%
Density≧99.7%
powder metallurgy method
90:10wt%; 95:5wt%; 99:1wt%; 85:15wt%

It plays an important role in transparent electrodes for screens and solar cells, and is used as a transparent heating element material in building and automobile windows to prevent condensation and snow accumulation.

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Aluminum oxide (AI₂O₃) target

Purity>99.9%
Density≧90%
powder metallurgy method

Insulating films in chip manufacturing, high-performance electronic components
Sensors, solar panels, displays, etc.
Surface modification of optical devices, architectural glass
Conductive film formation, solar cell

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Indium oxide (In₂O₃) target

Purity > 99.99% *Firing traces are likely to remain
Density ≥ 90%
Sintering method, HP method

LCD, OLED, plasma displays, etc.
Voltage application electrodes in touch panels
Transparent electrodes in solar cells
Anti-fogging windshields and shop windows

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niobium-oxide-target-electrically-insulating

Niobium oxide (Nb₂O₅) target

Purity>99.9% *Non-conductive
Density≧90%
HIP method

Miniaturization and high performance of optical products
Multilayer ceramic capacitors (MLCC)
LCD panels, hard disks
Thin-film formation in semiconductors, solar cells

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Silicon Target

Single crystal silicon (Si) target

Purity>99.99999%
Manufacturing method: SZ method

Integrated circuits (ICs), large-scale integrated circuits (LSIs)
Thin film formation required for optical devices
Sensors, solar cells, transformers

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Single crystal silicon (Si) planar target

Purity>99.99999%
Density (2.33/cm³)
Manufacturing method: SZ method

Integrated circuits (ICs), large-scale integrated circuits (LSIs)
Thin film formation required for optical devices
Sensors, solar cells, transformers

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Polycrystalline silicon (Si) target

Purity >99.999%
Manufacturing method: Melting and sintering

CVD equipment, annealing furnaces, diffusion furnaces, and film deposition in LCD manufacturing equipment
Thin-film silicon solar cells, solar panels
Gears, sensors, and microelectrostatic motors

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Polycrystalline silicon (Si) ring target

Purity >99.999%
Density (2.33/cm³)
Manufacturing Method: Melting and Sintering

CVD equipment, annealing furnaces, diffusion furnaces, liquid crystal manufacturing equipment
Thin-film silicon solar cells, solar panels
Microstructures such as gears, sensors, and microelectrostatic motors

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Rotary Target

Chromium (Cr)
Rotary Target

Molybdenum (Mo)
Rotary Target

Niobium oxide (Nb₂O₅)
Rotary target

Aluminum Silicon (AlSi)
Rotary Target

Titanium (Ti)
Rotary Target

Copper (Cu)
Rotary Target

Aluminum (Al)
Rotary Target

Products

Metal Target

Copper (Cu) target

Chromium (Cr) target

Niobium (Nb) target

Zirconium (Zr) target

Titanium (Ti) target

Tantalum (Ta) target

Iron (Fe) target

Hafnium (Hf) target

Nickel (Ni) target

Tin (Sn) target

Tungsten (W) target

Alloy Target

Nickel chromium (NiCr)target

Aluminum neodymium (Al-Nd)Target

Tungsten Titanium (W-Ti)Target

Nickel vanadium (NiV)target

Aluminum silicon (Al-Si) target

C18200 (CuCr) Backing plate

Nickel Copper (NiCu)Target

Aluminum titanium (Al-Ti) target

C18150 (CuCr1Zr) Backing plate

Oxide Target

Titanium dioxide (TiO₂) target

Nickel oxide (NiO) target

Tin oxide (SnO) target

Indium antimonide (IAO) target

Vanadium oxide (V₂O₅) target

Quartz (SiO₂) ring

Niobium oxide (Nb₂O₅) target

ITO (90% In₂O₃ 10% SnO₂) Target

Aluminum oxide (AI₂O₃) target

Indium oxide (In₂O₃) target

Niobium oxide (Nb₂O₅) target

Silicon Target

Single crystal silicon (Si) target

Single crystal silicon (Si) planar target

Polycrystalline silicon (Si) target

Polycrystalline silicon (Si) ring target

Rotary Target

Chromium (Cr)Rotary Target

Molybdenum (Mo)Rotary Target

Niobium oxide (Nb₂O₅)Rotary target

Aluminum Silicon (AlSi)Rotary Target

Titanium (Ti)Rotary Target

Copper (Cu)Rotary Target

Aluminum (Al)Rotary Target

Silicon (Si)Rotary Target

Spattercore Co., Ltd.

Nickel chromium (NiCr)
target

Aluminum neodymium (Al-Nd)
Target

Tungsten Titanium (W-Ti)
Target

Nickel vanadium (NiV)
target

Nickel Copper (NiCu)
Target

Chromium (Cr)
Rotary Target

Molybdenum (Mo)
Rotary Target

Niobium oxide (Nb₂O₅)
Rotary target

Aluminum Silicon (AlSi)
Rotary Target

Titanium (Ti)
Rotary Target

Copper (Cu)
Rotary Target

Aluminum (Al)
Rotary Target

Silicon (Si)
Rotary Target