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Tantalum (Ta) target

Purity: 99.9%~99.999%
Manufacturing method: Vacuum smelting method


• Tantalum (Ta) targets are mainly used for sputtering deposition and are utilized in fields such as semiconductor barrier layers, capacitors, and corrosion-resistant coatings.
• Semiconductors and electronics
• Barrier layers for copper wiring
• Capacitors and resistive films
• Thin-film transistors (TFTs)
• Industrial coatings and others
• Corrosion-resistant and high-temperature coatings
• Optics and medical: also used for optical coatings and the manufacture of medical device components.
• Features of our targets
• High purity (≥ 5N)
• To enhance the uniformity of fine-crystal-grain film deposition, refinement and homogenization of crystal grain size are regarded as important.
• Please let us know if specific purity or shape specifications (circular, square, etc.) are required.

tantalum-target

Spattercore Co., Ltd.

〒532‐0011

6-3-32 Nishinakajima, Yodogawa-ku, Osaka City, Osaka Prefecture

Shin-Osaka Building 2, Room 707

TEL: 06-6732-9818

FAX: 06-6732-9819

Business hours: Weekdays 9:00-17:00

Sputtercore Co., Ltd.

6-3-32 Nishinakajima, Yodogawa-ku,
Osaka 532-0011, Japan,

No.2 Shin-Osaka Bldg. Room#707

TEL: +81-6-6732-9818

FAX: +81-6-6732-9819

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ISO9001

Copyright © Sputtercore Co. Ltd. All Rights Reserved.

Certified on June 25, 2026
ISO 9001 Quality Management System

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