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Nickel Copper (NiCu)
Target

Purity>99.9%
Manufacturing method: Vacuum smelting method

Semiconductor integrated circuits (VLSI)
Flat panel displays
Optical discs, surface coatings

nickel-copper-target

Spattercore Co., Ltd.

〒532‐0011

6-3-32 Nishinakajima, Yodogawa-ku, Osaka City, Osaka Prefecture

Shin-Osaka Building 2, Room 707

TEL: 06-6732-9818

FAX: 06-6732-9819

Business hours: Weekdays 9:00-17:00

Sputtercore Co., Ltd.

6-3-32 Nishinakajima, Yodogawa-ku,
Osaka 532-0011, Japan,

No.2 Shin-Osaka Bldg. Room#707

TEL: +81-6-6732-9818

FAX: +81-6-6732-9819

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Copyright © Sputtercore Co. Ltd. All Rights Reserved.

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