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Tungsten (W) target

Purity: 99.9% - 99.999%
Manufacturing Method: Sintering + Rolling


• Semiconductors and microelectronics
• Semiconductor manufacturing: indispensable for the manufacture of integrated circuits and microelectronics devices.
• TFT liquid crystals
• Frequency filters: used for layer formation in SAW (surface acoustic wave) filters and BAW (bulk acoustic wave) filters. (We have usage records.)
• Diffusion barrier layers: function as diffusion barriers made of tungsten nitride.
• Wiring and conductor tracks: used for conductor tracks in microelectronics components.
• Transparent layers: used as transparent layers by reactive sputtering of tungsten oxide in organic EL displays and the electrochemical field.
• Inspection probe pins: tungsten probe pins (contact pins) are used for inspecting high-density integrated circuits in semiconductors and liquid crystal panels.
• Tools and wear-resistant coatings
• Heat-resistant components
• Nuclear industry
• Medical and X-ray related
• New energy and others
• Thin-film deposition: used for high-quality coatings for optical components and electronic components.

tungsten target

Spattercore Co., Ltd.

〒532‐0011

6-3-32 Nishinakajima, Yodogawa-ku, Osaka City, Osaka Prefecture

Shin-Osaka Building 2, Room 707

TEL: 06-6732-9818

FAX: 06-6732-9819

Business hours: Weekdays 9:00-17:00

Sputtercore Co., Ltd.

6-3-32 Nishinakajima, Yodogawa-ku,
Osaka 532-0011, Japan,

No.2 Shin-Osaka Bldg. Room#707

TEL: +81-6-6732-9818

FAX: +81-6-6732-9819

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ISO9001

Copyright © Sputtercore Co. Ltd. All Rights Reserved.

Certified on June 25, 2026
ISO 9001 Quality Management System

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