Copper (Cu) target
Purity: 99.97%~99.9999%
Manufacturing method: dissolution method
• Semiconductors and microelectronics
• Copper wiring (Cu interconnects)
• Seed layers:
• Improvement of wiring materials: Cu-Al alloy and Cu-Mn alloy targets contribute to improving electromigration resistance and corrosion resistance. (We can also manufacture these.)
• Display technology
• TFT liquid crystal panels
• Flat panel displays (FPDs)
• Optical coatings
• Surface technology
• Features of our targets
• High purity ≥ 6N
• Low oxygen content: Oxygen content can be made 3 ppm or less.
• Crystal grain size: The crystal grain structure is regarded as important in order to ensure film deposition uniformity.
• Please let us know if specific purity or shape specifications (planar, rotary, special-shaped) are required.
