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Polycrystalline silicon (Si) target

Purity >99.999%
Manufacturing method: Melting and sintering


It is used as a component for equipment such as CVD equipment, annealing furnaces, and diffusion furnaces.
It is suitable for applications requiring high purity and thermal properties, and is used as a material in sputtering film formation processes, and as a component in liquid crystal manufacturing equipment.
It is also used in the manufacture of solar panels, such as thin-film silicon solar cells.
Because production costs are lower than with single crystals, it is suitable for mass production, and is also used in research and prototyping of microstructures such as gears, sensors, and microelectrostatic motors.

CVD equipment, annealing furnaces, diffusion furnaces, and film deposition in LCD manufacturing equipment
Thin-film silicon solar cells, solar panels
Gears, sensors, and microelectrostatic motors

polycrystalline-silicon-target

Spattercore Co., Ltd.

〒532‐0011

6-3-32 Nishinakajima, Yodogawa-ku, Osaka City, Osaka Prefecture

Shin-Osaka Building 2, Room 707

TEL: 06-6732-9818

FAX: 06-6732-9819

Business hours: Weekdays 9:00-17:00

Sputtercore Co., Ltd.

6-3-32 Nishinakajima, Yodogawa-ku,
Osaka 532-0011, Japan,

No.2 Shin-Osaka Bldg. Room#707

TEL: +81-6-6732-9818

FAX: +81-6-6732-9819

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