Nickel (Ni) target
Purity: 99.9%~99.99%
Manufacturing method: dissolution method
• Semiconductors and electronics
• Thin-film deposition
• Gate electrodes and silicide films
• Barrier layers: Ni-Cu-based alloy targets are used to form barrier layers that suppress the diffusion of Sn solder. (We can also manufacture NiCu targets.)
• Integrated circuits
• Magnetic recording and magnetic materials
• Magnetic storage media
• Permanent magnets and electromagnets
• Decorative and corrosion-resistant coatings
• Features of the targets
• Purity ≥ 4N
• For nickel targets, the crystal structure is regarded as important in order to ensure film thickness uniformity.
• Alloy development: A diverse range of alloy targets such as NiCr, NiTi, NiCu, and CuNiTi is offered according to the application.
• Please let us know if specific purity or shape specifications (circular, square, etc.) are required.
