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  • Products | Sputtering Targets, Evaporation Materials & Thin Film Materials | SputterCore Co., Ltd.

    スパッタコアは、金属・合金・セラミックのスパッタリングターゲットを中心に、蒸着材料、薄膜材料などとして提供しております。 タングステン ハフニュウム ジルコニュウム モリブデン シリコン ゲルマニュウム チタン タンタル ロータリーターゲット Products Metal Target Copper (Cu) target Purity: 99.97%~99.9999% Manufacturing method: dissolution method LCD displays Touch panels Semiconductor electrodes View details Chromium (Cr) target Purity: 99.5%~99.98% Manufacturing method: HIP method, density ≧99% Automotive mirrors, semiconductor wiring, displays, hard disks, electronic components, decorative coatings, sensitive materials View details Niobium (Nb) target Purity: 99.9%~99.999% Manufacturing method: Vacuum smelting method Thin film formation Superconducting materials Heat- and corrosion-resistant applications View details Zirconium (Zr) target Purity: 99.5%~99.99% Semiconductors: High-K insulating films, ferroelectric memory Optical lenses, mirror coatings Surface coatings, corrosion resistance, heat resistance, nuclear View details Titanium (Ti) target Purity: 99.5%~99.999% Manufacturing method: dissolution method Semiconductor electrodes Integrated circuits Liquid crystal displays View details Tantalum (Ta) target Purity: 99.9%~99.999% Manufacturing method: Vacuum smelting method Capacitor manufacturing Thin film formation (optics, aerospace) High-temperature technology View details Iron (Fe) target Purity: 99.9%~99.999% Manufacturing method: Vacuum smelting method Thin film formation Superconducting materials Heat- and corrosion-resistant applications View details Hafnium (Hf) target Purity: 99.5%~99.9% Semiconductors: High-K gate dielectrics for reduced leakage current High-bandwidth memory, aerospace (supersonic aircraft) Optical coatings, sensitive materials View details Nickel (Ni) target Purity: 99.9%~99.99% Manufacturing method: dissolution method Semiconductor electrodes, integrated circuits, liquid crystal displays, touch panels View details Tin (Sn) target Purity: 99.9%~99.995% Manufacturing method: Vacuum smelting method Semiconductors, displays, solar panels, thin film formation for electronic devices and architectural glass View details Tungsten (W) target Purity: 99.9% - 99.999% Manufacturing Method: Sintering + Rolling Semiconductor electrodes Integrated circuits Heat dissipation layers in high-power electronic devices View details Alloy Target Nickel chromium (NiCr) target Purity>99.5%~99.9% Manufacturing method: Vacuum smelting method Thin film formation, microelectronics manufacturing Low-E coating for architectural glass LCD panels, recording media, semiconductors, and solar cells View details Aluminum neodymium (Al-Nd) Target Purity > 99.95% Manufacturing Method: Vacuum Melting Size: 809.5 x 879.5 x 16mm (single piece available) Flat panel displays (FPDs) Magnetic recording media, magnetic sensors View details Tungsten Titanium (W-Ti) Target Purity>99.95% Manufacturing method: powder metallurgy method Microchips, thin film formation, solar cells Diffusion inhibitors and adhesives for metal wiring View details Nickel vanadium (NiV) target Purity>99.5%~99.9% Manufacturing method: Vacuum smelting method Integrated circuit (IC) manufacturing Semiconductor and microelectronics industry High-quality thin film deposition View details Aluminum silicon (Al-Si) target Purity >99.999% Manufacturing method: Sintering Flat Panel Displays (FPDs) Magnetic Recording Media Magnetic Sensors View details C18200 (CuCr) Backing plate Purity>99.97% Manufacturing method: Vacuum smelting method Used as a backing plate Hardness ≥ 1/2H View details Nickel Copper (NiCu) Target Purity>99.9% Manufacturing method: Vacuum smelting method Semiconductor integrated circuits (VLSI) Flat panel displays Optical discs, surface coatings View details Aluminum titanium (Al-Ti) target Purity>99.999% Manufacturing method: smelting method Cutting tool coatings, barrier film formation Semiconductor device transistors and integrated circuits Display and decorative coatings View details C18150 (CuCr1Zr) Backing plate Purity>98% Manufacturing method: Vacuum smelting method Used as a backing plate Hardness ≥ 1/2H View details Oxide Target Titanium dioxide (TiO₂) target Purity >99.9% Conductivity Density ≥90% Vacuum sintering, HP method High-refractive-index lenses, optical filters, semiconductors Recording media such as hard disk drives Thin-film formation for flat panel displays Photocatalysts (decomposition of atmospheric nitrogen oxides, antibacterial properties) View details Nickel oxide (NiO) target Purity > 99.99% Density ≥ 85% Sintering method, HP method Resistive Random Access Memory (RRAM) Transparent Conductive Oxide (TCO) Gas Sensors Spintronics View details Tin oxide (SnO) target Purity > 99.99% Density ≥ 85% Sintering method, HP method Important materials for screen construction Transparent electrodes enabling touchscreen operation Anti-static film, electromagnetic wave shielding film Transparent heater, gas sensor View details Indium antimonide (IAO) target Purity > 99.99% Density ≥ 85% Sintering method HP method Anti-static coatings, widely used in paints, significantly reduce static buildup, and protect the safety of equipment and personnel. View details Vanadium oxide (V₂O₅) target Purity > 99.9% *Toxic Density ≥ 85% Vacuum sintering, HP method Thin film deposition for high-definition displays and optical devices Optical coatings and sensor technology Catalysts for organic acid production Improved solar cell performance and efficiency View details Quartz (SiO₂) ring Purity>99.995% Density (2.6g/cm³) Sintering method Semiconductor manufacturing process Optical equipment Chemical laboratory equipment Medical equipment View details Niobium oxide (Nb₂O₅) target Purity>99.9% *Electrically conductive Density≧99% HIP method Miniaturization and high performance of optical products Multilayer ceramic capacitors (MLCC) LCD panels, hard disks Thin-film formation in semiconductors, solar cells View details ITO (90% In₂O₃ 10% SnO₂) Target Purity>99.99% Density≧99.7% powder metallurgy method 90:10wt%; 95:5wt%; 99:1wt%; 85:15wt% It plays an important role in transparent electrodes for screens and solar cells, and is used as a transparent heating element material in building and automobile windows to prevent condensation and snow accumulation. View details Aluminum oxide (AI₂O₃) target Purity>99.9% Density≧90% powder metallurgy method Insulating films in chip manufacturing, high-performance electronic components Sensors, solar panels, displays, etc. Surface modification of optical devices, architectural glass Conductive film formation, solar cell View details Indium oxide (In₂O₃) target Purity > 99.99% *Firing traces are likely to remain Density ≥ 90% Sintering method, HP method LCD, OLED, plasma displays, etc. Voltage application electrodes in touch panels Transparent electrodes in solar cells Anti-fogging windshields and shop windows View details Niobium oxide (Nb₂O₅) target Purity>99.9% *Non-conductive Density≧90% HIP method Miniaturization and high performance of optical products Multilayer ceramic capacitors (MLCC) LCD panels, hard disks Thin-film formation in semiconductors, solar cells View details Silicon Target Single crystal silicon (Si) target Purity>99.99999% Manufacturing method: SZ method Integrated circuits (ICs), large-scale integrated circuits (LSIs) Thin film formation required for optical devices Sensors, solar cells, transformers View details Single crystal silicon (Si) planar target Purity>99.99999% Density (2.33/cm³) Manufacturing method: SZ method Integrated circuits (ICs), large-scale integrated circuits (LSIs) Thin film formation required for optical devices Sensors, solar cells, transformers View details Polycrystalline silicon (Si) target Purity >99.999% Manufacturing method: Melting and sintering CVD equipment, annealing furnaces, diffusion furnaces, and film deposition in LCD manufacturing equipment Thin-film silicon solar cells, solar panels Gears, sensors, and microelectrostatic motors View details Polycrystalline silicon (Si) ring target Purity >99.999% Density (2.33/cm³) Manufacturing Method: Melting and Sintering CVD equipment, annealing furnaces, diffusion furnaces, liquid crystal manufacturing equipment Thin-film silicon solar cells, solar panels Microstructures such as gears, sensors, and microelectrostatic motors View details Rotary Target Chromium (Cr) Rotary Target Molybdenum (Mo) Rotary Target Niobium oxide (Nb₂O₅) Rotary target Aluminum Silicon (AlSi) Rotary Target Titanium (Ti) Rotary Target Copper (Cu) Rotary Target Aluminum (Al) Rotary Target Silicon (Si) Rotary Target

  • Inquiry Services Page | Sputtercore

    Explore our services and get in touch Our Services 01. カスタムプロジェクト お客様のユニークなニーズに合わせたオーダーメイドのソリューションをご提供します。初期のアイデア出しから実行まで、専任チームが緊密に連携し、目標達成をサポートいたします。柔軟な対応で、あらゆる課題にお応えします。 Show more 02. パーソナルソリューションプランニング 個々のお客様のご状況や目標を深く理解し、最適な解決策を共に計画します。詳細なヒアリングを通じて、お客様一人ひとりに寄り添った実現可能なプランを作成いたします。専門的な視点から、お客様の成功を支援します。 Show more 03. 専門家ガイダンスパッケージ 貴社のビジネス課題に対し、経験豊富な専門家が段階的なガイダンスを提供します。戦略立案から実行支援まで、成功へのロードマップを明確に描きます。このパッケージで、確かな成長への一歩を踏み出しましょう。 Show more

  • PVD, Vacuum Deposition & Sputtering Thin Film Materials | Sputter Targets & Evaporation Materials | SputterCore Co., Ltd.

    株式会社スパッタコアは、高品質な薄膜材料(スパッタリングターゲット)を専門に扱うサプライヤーです。メーカー様とユーザー様の間に立ち、技術課題に応じた最適な素材・加工法をご提案。調達・供給から試作支援、輸出入まで一貫してサポートします。 Connecting technology. Delivering trust. We provide high-quality thin film materials that support the semiconductor and display fields. We are a trading company that carefully selects products from manufacturers around the world and delivers them with guaranteed quality. While staying close to the manufacturing site, We want to be a "sincere partner" that connects technology and people. Contact Us From "procuring" to "co-creating" We stand between manufacturers and users, We understand the technical challenges and propose the most suitable materials and processing methods. Our company strictly adheres to national laws and regulations. For controlled target materials such as Zirconium, Hafnium, Tungsten, Tantalum, and Chromium, we have successfully obtained all necessary permits from the authorities to ensure full compliance throughout our operations. As a professional supplier deeply engaged in the target material field for many years, we have established a full-chain quality control system covering procurement, warehousing, production, and inspection — from selecting high-quality raw materials to shipping finished products, every batch undergoes precise testing to ensure that key indicators like Sputtering Target purity, Sputtering Target density, and Sputtering Target grain size consistently meet international advanced standards. In response to policy changes, we maintain stable supply for our longtime customers through ample stock reserves, flexible production capacity, and efficient logistics. Historical records show that no customer’s production schedule has ever been affected by control measures, with a 100% order fulfillment rate and rapid response to urgent needs. We fully understand how crucial a stable supply is to our clients' production lines, so we continuously optimize inventory management and quality traceability systems to deliver on our promises. Moving forward, we will continue to uphold compliance as our foundation and high-quality target materials as our core, aiming to be our customers' most trusted long-term partner. From the research and development stage to mass production, We provide consistent support for our customers' manufacturing. To business introduction Products and technical fields Areas of business Semiconductors, smartphones, displays, Optical devices, electronic components, etc. Main products ・Ultra-thin metal coating (Au, Ag, Cu, Ti, Ni, etc.) ・Sputtering targets/evaporation materials ・Special alloys, functional thin film materials ・Custom specifications and small lot orders are also available. Through high quality and stable supply, We provide technical accuracy and peace of mind. View product list Recruitment history semiconductor Apple iPhone chip space satellite Aircraft Smart Windows Metal Rotary Target Metal Planar Target Alloy Target Silicon Target View product list Products Service flow We respond quickly and carefully to various customer needs, including research and development. 1. Inquiries and consultations 2. Hearing 3. Proposal and estimate 4. Place your order 5. Manufacturing → Inspection → Shipping 6. Delivery We can handle your order within 3 weeks from order to delivery. Inquiries and consultations Please feel free to contact us with any inquiries or quotes regarding material selection and procurement. Our technical staff will make the best proposal based on your application and requests. Contact form

  • Corporate Philosophy | Sputtering Target Manufacturing and Supply | SputterCore Co., Ltd.

    高品質な薄膜材料(スパッタリングターゲット)を専門に扱うサプライヤー株式会社スパッタコアの企業理念と代表メッセージです。 Corporate Philosophy Supporting Japanese manufacturing through “Reliable Supply” “Connecting technology and society through honest business practices.” As a trusted technical partner, we support manufacturing worldwide and contribute to people and society. Message from the President Since our founding, we have valued “integrity” and “technical understanding,” supporting our customers' value creation through materials. In the rapidly evolving semiconductor and electronics industry, what is required is not only “quality” but also “trust.” We aim to be a partner that stands alongside both manufacturers and users, providing long-term, reliable relationships. Sputtercore Co.,Ltd. Representative Director Kazuya Nakatani

  • Business Introduction | Procurement Support for PVD, Vacuum Deposition & Sputtering Materials | SputterCore Co., Ltd.

    株式会社スパッタコアは、金属薄膜材料・スパッタリングターゲット・蒸着材料の調達に強い "技術の架け橋" です。研究開発から量産まで、試作支援・技術サポート・海外調達・輸出入業務まで一貫支援。確かな品質と迅速な供給で、メーカー様のものづくりを強力にバックアップします。 About Us We are not just a supplier, but a company that “creates together.” Standing between manufacturers and users,we understand technical challenges and propose the best materials and processing methods. Each of the four target material manufacturing processes has its own perks. Here's a quick rundown: · HIP (Hot Isostatic Pressing): Pushes evenly in all directions, super dense, low oxygen, and coatings come out uniform; downside is it's pricey, packaging is tricky, and overall cost is high. · HP (Hot Pressing): Pretty simple process, High density; but mostly only presses in one direction, so full density is tricky, sizes are limited, and production speed is slower. · Melting: Ultra-pure, low gas impurities, dense, and can be scaled up; but for multi-component alloys with big differences in melting points and density, it's hard to keep composition uniform. · Sintering: Mature process, good for mass production, cheaper; but density's usually not great, pores can stay, and controlling grain size is tough. We provide comprehensive support for our customers' manufacturing needs, from research and development through to mass production. Sputtercore's Strengths As a “Bridge of technology” and “Import/Export partner” between manufacturers and users, we support the reliable procurement of electronic materials and metal products. High Quality, Low Price We build trust with overseas manufacturers strong technical capabilities and robust quality control systems, ensuring reliable procurement. Extensive Product Range By collaborating with overseas manufacturers who maintain over 100 types of materials in stock at all times, we can flexibly meet manufacturers' needs. Delivery within 3 Weeks Guaranteed Leveraging our overseas manufacturer network, we can swiftly deliver the optimal target material. Our Commitment to Quality We have obtained ISO 9001, the international standard for Quality Management Systems. We are committed to maintaining and continuously improving our quality management system to deliver products and services that our customers can trust. >View Certificate Certification Standard : ISO 9001:2015 Certification Body : SGS Japan Inc. Certification Date : June 25, 2025 Registration No. : CN26/00004591

  • Inquiries & Consultations | Sputtering Target Manufacturing and Supply | SputterCore Co., Ltd.

    株式会社スパッタコアへのお問い合わせフォームです。素材の選定や調達に関するご相談やお見積りなど、どうぞお気軽にお寄せください。 技術担当が、用途やご要望に合わせて最適なご提案をいたします。 Inquiries & Consultations Please feel free to contact us for consultations or quotes regarding material selection and procurement. Our technical staff will provide optimal proposals tailored to your application and requirements. Full Name(Required) Email(Required) Company Name Phone How did you hear about our company? (Required) please select Name of the person who introduced you, if any Inquiry Type (Multiple selections allowed) Consultation on material selection and sourcing Questions about product specifications and characteristics Inquiries about lead time and inventory Request for quotation Other Details of your inquiry Submit Phone Inquiries TEL:06-6732-9818 Business Hours: Weekdays 9:00–17:00 (Closed on weekends and holidays)

  • FAQ | Sputtering Target Manufacturing and Supply | SputterCore Co., Ltd.

    株式会社スパッタコアに、よくお寄せいただくお客様からの疑問・質問にお答えしています。ぜひ一度ご確認ください  タングステン ハフニュウム ジルコニュウム ゲルマニュウム FAQ We have compiled a list of frequently asked questions from our customers. Do you have experience with germanium (Ge) targets? Yes, we have experience handling germanium (Ge) targets. Please inquire for price, delivery time, and other details. Is it possible to ship materials that are difficult like Tungsten、Zirconium、Hafnium to obtain? Yes, we have a system in place that allows us to ship based on our past track record and experience. Is the quote free? Yes, it is free. Can you provide a quote without drawings? Yes, we can provide a quote based on specification information alone. Can you handle small-volume orders? Yes, we accept orders starting from a single unit. We handle everything from prototypes for R&D to large-volume orders. Please feel free to consult with us. Please explain the quotation process.  Please fill in the message field of the inquiry form with your request ・Request quote via email ・Want to discuss by phone ・Request online meeting and submit it. A representative will contact you within 3 business days. What is the estimated delivery time? Delivery is typically within 3 weeks from order placement. For special specifications or cases requiring additional processing time, we will inform you during the quotation process. Can I schedule an individual consultation online? Yes, we can accommodate that. How many days does it take to receive a response to my inquiry? We typically respond within three business days. If you require urgent assistance, please call our office. Alternatively, please submit your inquiry via the contact form with the subject line marked 【Urgent】. I submitted an inquiry via the form but haven't received a response. If you haven't received a reply after three business days, your email address may be incorrect or the message may have been filtered into your spam folder. We apologize for the inconvenience. Please check your email settings and contact us by phone. Sputtercore Co.,Ltd. Inquiry contact point(TEL:06-6732-9818)

  • Company Profile | Sputtering Target Manufacturing and Supply | SputterCore Co., Ltd.

    株式会社スパッタコアは、高品質な薄膜材料(スパッタリングターゲット)を専門に扱うサプライヤーです。 メーカー様とユーザー様の間に立ち、技術課題に応じた最適な素材・加工法をご提案。 調達・供給から試作支援、輸出入まで一貫してサポートします。 Company Profile Company name Sputtercore Co.,Ltd. Registered Office Address 〒532‐0011 6-3-32 Nishinakajima, Yodogawa-ku, Osaka City, Osaka Prefecture Shin-Osaka Building 2, Room 707 Phone number TEL:06-6732-9818  FAX:06-6732-9819 Representative Name Representative Director    Kazuya Nakatani Business Activities Sputtering target‘s sales, import/export, and custom order services Fields Covered:(Semiconductors/Optical devices/Electronic components/etc.) Sputtering target Supplier Corresponding Business Operations  ☐ Product selection support  ☐ Technical consultation  ☐ Custom specifications and small lots available.  ☐ Short delivery time response  ☐ Import/Export shipment arrangement Date of establishment December 25, 2024 Capital fund 10,000,000 JPY Certification ISO 9001 >View Certificate Company history December 2024 Established “TARGET-TECH CO., LTD.”  September 2025 Company name was changed as “Sputtercore Co.,Ltd.” June 2026 Obtained ISO 9001 Quality Management System (QMS) Certification

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Spattercore Co., Ltd.

〒532‐0011

6-3-32 Nishinakajima, Yodogawa-ku, Osaka City, Osaka Prefecture

Shin-Osaka Building 2, Room 707

TEL: 06-6732-9818

FAX: 06-6732-9819

Business hours: Weekdays 9:00-17:00

Sputtercore Co., Ltd.

6-3-32 Nishinakajima, Yodogawa-ku,
Osaka 532-0011, Japan,

No.2 Shin-Osaka Bldg. Room#707

TEL: +81-6-6732-9818

FAX: +81-6-6732-9819

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Copyright © Sputtercore Co. Ltd. All Rights Reserved.

Certified on June 25, 2026
ISO 9001 Quality Management System

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