Sputtering targets made from high-purity tungsten (W) or W alloys, mainly used for physical vapor deposition (PVD) and magnetron sputtering.

Tungsten (W) has an extremely high melting point, high density, excellent high temperature resistance and chemical stability,

and plays an important role in the semiconductor, aerospace, nuclear industry, display panel, etc.

1. Characteristics

1) Ultra high melting point and high temperature resistance

2) High density (19.25 g/cm³)

3) Excellent electrical and thermal conductivity

・Suitable for interconnecting layers between semiconductor electrodes and integrated circuits with

electrical conductivity of 18.2 MS/m.

・Good thermal conductivity for use in the heat dissipation layer of high-power electronic devices.

4）Extremely strong corrosion resistance

5) High hardness and wear resistance

6）Alloying available

・Alloy targets (e.g., W-Ti, W-Cu) can be formed with Ti, Ta, Re, Cu, etc. to optimize thin film performance 

(e.g., stress reduction, conductivity improvement).

2. Main Applications

1) Semiconductors and microelectrons

・Integrated circuits (ICs):Used in gate and interconnect layers instead of aluminum/copper to reduce resistance.

・3D NAND and DRAM memory chips: Used as a barrier layer to prevent copper diffusion.

・Used as an electrode material for power devices IGBT and MOSFET, for example.

2) Display panels (OLED/LCD).

3) Aerospace and nuclear industries.

4) Wear-resistant and protective coatings.

・Coating cutting tools (drills, milling machines, etc.) with tungsten film to extend their usage life.

6）New energy