Alloy sputtering targets consisting of copper (Cu) and nickel (Ni) to produce functional thin films mainly by processes such as magnetron sputtering (PVD) and electron beam evaporation. Due to their unique electrical conductivity, corrosion resistance and tunable performance, CuNi targets are widely used in fields such as electronics, decoration and marine engineering.

1. Characteristics

1) Excellent electrical and thermal conductivity

・CuNi alloys such as Cu 90 Ni 10 have low resistivity (~ 20 μΩ-cm), close to pure copper, and are suitable for highly conductive thin films.

・They have high thermal conductivity (~ 50 W/(m-K)) and are suitable for heat dissipation coatings and electronic packages.

2) Good corrosion resistance

・The addition of Ni significantly improves the corrosion resistance of copper, especially in seawater and acidic environments (e.g.,ship components).

・Oxidation resistance is superior to that of pure copper, and Cu₂O is less likely to form even at high temperatures, thus  extending the life of the coating.

3) High purity and adjustable composition

・Industrial grade CuNi target purity ≥99.9%, requirement for high-end use(e.g. semiconductor) ≥99.99%.

・Typical composition ratios: cupronickel such as Cu 90 Ni 10 , Cu 70 Ni 30 different ratios affect resistivity, mechanical strength and corrosion resistance.

4) Excellent mechanical performance

・The alloy has moderate hardness (HV 80-150), ductility and abrasion resistance, and is suitable for flexible electronic substrate coatings.

・The grain structure can be adjusted by heat treatment to optimize thin film stress.

5) High sputtering stability

・Vacuum induction melting (VIM) or powder metallurgy processes ensure target induced density >98% and reduce sputtering of sputter particles.

2. Main Applications

1) Electronics and semiconductor industries

・Integrated circuit wiring: Reduce electromigration problems in CPU/GPU metal wiring layers, etc., instead of pure copper.

・Flexible printed circuits (FPC): conductive film for folding screens that combines flexibility and high conductivity. 

2) Marine construction and preservative coating

・Marine components: Coating propellers and seawater pipes to prevent corrosion in seawater.

・Petrochemical plants: Surface protection of valves and heat exchangers, resisting H₂S/CO₂ corrosion.

3) Decoration and appearance

・Jewelry, watches: gold equivalent coating (e.g., Cu 85 Ni 15 gives rose gold color).

・Appliance cases: Provides a metallic texture and is resistant to fingerprint oxidation.

4) Thermal management materials

・Coatings for heat sinks: enhance heat dissipation efficiency of electronic devices such as LED, power modules, etc.

・Thermal interface materials (TIM): Fill the gap between CPU and heat sinks to enhance thermal conduction.

5) New Application Fields

・Electromagnetic shielding: CuNi thin film is used in 5 G device enclosures to reduce signal interference.

・New energy batteries: Lithium current collector coating to improve current collection efficiency.