Copper target is mainly used in physical vapor deposition (PVD) and magnetron sputtering methods.

Their excellent electrical and thermal conductivity and good processing performance are widely applied in the fields of semiconductor, display technology, optical coating film, and new energy.

1. Characteristics

1) Physical Properties

・High purity: 99.9% (3 N) to 99.9999% (6 N), ultra high purity copper (6 N) is used for high-end semiconductor manufacturing.

・High conductivity: conductivity of 58 MS/m (second only to silver), suitable for highly conductive thin films.

・High thermal conductivity: Excellent heat dissipation performance, suitable for high-power electronic devices.

・Low melting point: melting point 1083.4°C, boiling point 2567°C, easy to sputter.

・Moderate density: 8.92 g/cm³, easy to process and install.

2) Chemical Properties

・Weak antioxidant properties

・General corrosion resistance

3) Mechanical Properties

・High plastic workability

・Easy to form twinned crystals

2. Main applications

1) Semiconductors and microelectrons

・Integrated circuits (IC)

・Memory devices: conductive and barrier layers in DRAM and 3D NAND.

・Power devices: electrode materials for IGBT and MOSFET.

2) Display technology (LCD/OLED)
3) Optical coatings

・Reflector: Copper film has a reflectivity of up to 95% and is used in lasers and telescopes.

・Filters: adjusting the transmittance of specific wavelength rays of light.

4) New energy

・Solar cells: key material for CIGS (copper indium gallium selenide) thin film cells.

・Fuel cells: For conductive coating of bipolar plates.

5) Others

・Magnetic recording: conductive layer of hard disk drive (HDD).

・Decorative