Al-Sc Target is alloy sputtering targets consisting of aluminum (Al) and scandium (Sc), and is mainly used in physical vapor deposition (PVD) and chemical vapor deposition (CVD) processes.

Scandium (Sc), a rare earth element, can significantly improve the performance of aluminum alloys and is widely used in fields such as semiconductor, aerospace, optics, and new energy.

1. Characteristics

1) Physical and chemical properties

・High purity (≥99.9%-99.999%) product reduces the adverse effects of impurities on thin film performance and is suitable for high-end semiconductor manufacturing.

・Lightweight and high strength: Low density (approx. 2.7 g/cm³) makes it lightweight, but its strength is significantly higher than that of pure Al, making it suitable for aerospace lightweight applications.

・It has excellent electrical and thermal conductivity and is suitable for conductive and heat dissipation layers in electronic devices.

・High melting point (1541°C, the melting point of scandium): the alloy's high-temperature stability makes it suitable for high-temperature environments.

・Corrosion resistance: The addition of Sc enhances the antioxidant capacity of aluminum, making it suitable for hostile environments.

2) Microstructural advantages

・Crystal grain refinement: Sc can inhibit grain growth and form a fine and uniform grain structure, which can enhance the strength, toughness and fatigue resistance of the material.

・Al3Sc precipitation phase: Al3Sc precipitation layer is formed, which enhances the alloy's creep resistance and makes it suitable for high temperature applications.

3) Machining performance

・Various shapes can be processed.

・Good sputtering uniformity: suitable for high-precision thin film deposition in semiconductor wafer fabrication.

2. Main Applications

1) Semiconductor and microelectronics industries

・5 G/6 G radio frequency filters: aluminum scandium nitride (ScAlN) piezoelectric thin film is produced and used to improve signal filter performance.

・Integrated circuit (IC) interconnect layers: replace conventional aluminum thin films, reduce resistance, and improve chip performance.