Mainly thin film deposition processes such as magnetron sputtering (PVD) and electron beam evaporation. Due to their excellent electrical conductivity, corrosion resistance and optical performance, AlNd targets are widely applied in fields such as semiconductors, flat panel displays,  photovoltaic  and optical plating films.

1. Characteristics

１）High purity and low impurity

・The purity of industrial grade AlNd target is usually ≥99.99%, and for high-end applications (e.g. semiconductors) it can reach 99.999% or higher.

・Strict control of impurities such as Fe, Si, and O is required, and oxygen content <200 ppm is required for some applications.

２）Excellent electrical conductivity and low resistivity

・AlNd alloy thin films have low resistivity and are suitable for producing TFT-LCD electrode layers and touch screen conductive films.

・The addition of neodymium reduces stress deformation of the film during heat treatment and improves the stability of the film layer. 

３）Good corrosion resistance

・The addition of neodymium significantly improves the seepage corrosion protection capability of aluminum thin films and extends the device life.

 ・ Suitable for coating electronic components in high humidity and high temperature environments.

４）High density and uniform microstructure

・In vacuum melting (VIM) or heat-in-place (HIP) processes, the target material has no pores and small crystal grains (<40μm), which enhances sputtering efficiency.

・Rotating target relative density >97%, suitable for large size plating.

５）Ratio of adjustable components

・General composition ratios: Al-2%Nd, Al-3%Nd , different ratios affect resistivity, corrosion resistance, and sputtering performance.

2. Main applications

１）Tablet displays and touch screens

 ・Used for TFT-LCD electrode layer instead of conventional Al-Si-Cu alloy to improve conductivity and corrosion resistance.

・Improvement of conductive layer stability and reduction of coating defects in touch screens (ITO glass).

２）Semiconductors and microelectrons

 ・Metal interconnect layers for integrated circuits (ICs) to reduce electrical migration problems.

・As a barrier layer, it prevents metal diffusion and improves device reliability.

３）Optical coatings and Low-E glass

・Anti-reflective film and infrared reflective film to improve optical properties of lenses and displays.

・Improvement of thermal insulation and reduction of energy consumption in architectural glass coatings. 

４）Power generation

・Used in the electrode layer of thin solar film solar cells to improve photoelectric conversion efficiency.

５）Aerospace and high temperature resistant coatings

・Used in high-temperature resistant coatings for aeroengine parts to improve antioxidant performance.